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MYIR Attended 2023 Hardware Developers Conference

2023-12-29   16:22:4     Click: 557

Shenzhen, China – December 29, 2023 – The 2023 Hardware Developer Conference, hosted by 'hw100k', was held at the Southern University of Science and Technology on December 9th, 2023. The conference convened many leading enterprises across various fields, including processors, single-chip computers, power supplies, and EDA, with a focus on specific hardware technologies. MYIR, a leading provider of embedded System-on-Modules (SoMs), attended the conference and showcased its CPU Modules and development boards based on the Allwinner T series processors.

MYIR provides CPU Modules and development boards based on the full coverage of AllWinner T-series processors, including the entry-level dual-core Cortex-A7 T113 series, the quad-core Cortex-A53 T507 series, and the octa-core Cortex-A55 T527 series. These products come with various configurations and multiple choices, designed to meet the diverse needs of customers. MYIR showcased the products at the developer conference, which attracted many industry customers, students and engineers, providing an opportunity for them to learn and exchange ideas.

MYIR Booth at the Hardware Developer Conference

The MYC-YT113X and the MYC-YT113i CPU Modules use AllWinner's T113 chips: T113-S3 and T113-i, which features dual-core Cortex-A7 processors. The Allwinner T113 series chip is an entry-level embedded industrial processor. Furthermore, the T113-S3 CPU Module is compatible with the T113-i CPU Module, offering designers multiple suitable choices for the same hardware design with two types of CPU chips and six configurations.

The MYC-YT507H CPU Module, designed using the Allwinner T507 processor, offers powerful computing capabilities. This automotive-grade processor features a 1.5GHz quad-core Cortex-A53 architecture and a Mali-G31 MP2 GPU, support 4k@60fps H. 265 video decoding and 4k@25fps H. 264 video encoding, ensuring smooth and professional visual effects. The MYC-YT507 offers a range of connectivity options, including dual network ports, four USB 2.0 interfaces, two SPIs, six UARTs, and two SDIOs. This flexibility allows it to be used in various applications such as power Internet of Things, automotive electronics, commercial displays, industrial control, medical devices and intelligent terminals.

The MYC-LT527M CPU Module, which is based on the Allwinner's T527 high-performance embedded processor, features an octa-core Cortex-A55 CPU clocked at up to 1.8GHz. The T527MN variant includes support for 2 Tops NPU, making it well-suited for edge intelligent AI acceleration applications. Additionally, it features a powerful G57 GPU and HiFi4 DSP multimedia functions, providing a range of communication interfaces with powerful functions. The module supports the Android operating system. As a result, the solutions can benefit numerous industries, including smart business display, retail payment, smart education, commercial robots, smart car/visual assistant driving, industrial control, edge computing, and intelligent power distribution terminals.

The conference was successfully concluded with the participation of the majority of engineers, students and other industry audiences. In the future, MYIR will continue to explore and innovate, providing engineers with higher quality products and a more comprehensive selection platform, and helping developers develop successfully.

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