The MYC-YR3562 System-On-Module (SOM), measuring just 43mm by 45mm, is powered by the Rockchip RK3562/RK3562J - a high-performance, low-power quad-core Arm Cortex-A53 processor family designed for consumer electronics equipment. It features a 1TOPS NPU (only for RK3562 CPU), a G52 3D GPU, and supports 1080p@60fps H.264 decoding, 4K@30fps H.265 decoding, and 1080p@60fps H.264 encoding. Available with 1GB/2GB LPDDR4 and 8GB/16GB eMMC, it includes a 32Kbit EEPROM and a Power Management IC (PMIC). The module features a 222-pin expansion interface with 164-pin Castellated-Hole and 58-pin in LGA package, which simplifies soldering onto base boards, enabling a range of I/O functionalities. It runs Linux 6.1.99 and comes with comprehensive documentation and software packages, making it suitable for applications such as smart electric devices, industrial IoT, robotics, and advanced industrial systems.
MYC-YR3562 System-On-Module Top-view and Bottom-view
MYIR’s MYD-YR3562 Development Board is designed for evaluating the MYC-YR3562 SOM. It features a base board with two USB3.0 ports, one Gigabit Ethernet, two 10/100Mbps Ethernet interfaces, onboard WiFi/Bluetooth, a Micro SD card slot, and an M.2 NVMe SSD-compatible PCIe slot. The board includes a variety of multimedia interfaces such as HDMI, MIPI-DSI, three MIPI-CSI video inputs, and audio. It also offers expansion flexibility through the RPI Interface (GPIO/I2C/UART/SPI/CAN-FD) and the MiFAN Interface (GPIO/I2C/UART/SPI/USB), enabling users to tailor their development projects.
MYD-YR3562 Development Board Top-view (RK3562 CPU)
MYD-YR3562 Development Board Top-view (RK3562 CPU)
The MYD-YR3562 is equipped with a 12V/3A power adapter, a USB Type-C cable, a WiFi/Bluetooth antenna, and a quick start guide. MYIR provides optional accessories, such as the MY-CAM004M 4AHD-to-MIPI Camera Module, MY-CAM005M MIPI Camera Module, and MY-MIPI101C 10.1-inch LCD Module. The MYD-YR3562J-GK kit, featuring the RK3562J CPU, includes the MY-ICEB001 expansion board, which adds three USB2.0 ports, one RS232 port, two RS485 ports, two CAN interfaces, and an M.2 Socket for a USB-based 4G/5G LTE Module with a SIM card holder, operating within a temperature range of -40 to 85 degrees Celsius. These enhancements substantially broaden the board's functionality, providing users with the flexibility to tailor the solution to their unique project needs.
MYD-YR3562 Development Board (RK3562J version) Integrates with the MY-ICEB001 Expansion Board
MYD-YR3562 Development Board (RK3562J version) Top-view
MYD-YR3562 Development Board (RK3562J version) Bottom-view
MY-ICEB001 Expansion Board
Features
Mechanical Parameters
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Dimensions: 43mm x 45mm
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PCB Layers: 10-layer design
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Power supply: 3.3V/2A
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Working temperature: 0~70 Celsius (commercial grade, with RK3562 CPU)
or -40~85 Celsius (industrial grade, with RK3562J CPU)
Processor
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Rockchip RK3562 / RK3562J processor
- Quad-core Arm Cortex-A53 at up to 2.2 GHz (RK3562)
Quad-core Arm Cortex-A53 at up to 1.2GHz/1.8GHz (RK3562J at normal mode/overdrive mode)
- Arm Mali-G52-2EE 3D GPU
- 6 TOPS NPU supports INT4/8/16/FP16/BF16/TF32
- Supports up to 1080p@60fps H.264 or 4K@30fps H.265 video decoding and up to 1080p@60fps H.264 video encoding
Memory and Storage
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1GB/2GB LPDDR4
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8GB/16GB eMMC
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32Kbit EEPROM
Peripherals and Signals Routed to Pins
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Power Management IC (PMIC)
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1.0 mm pitch 164-pin Castellated-Hole and 58-pin LGA expansion interfaces- 1x RGMII
- 1x RMII
- 1x USB3.0/2.0 OTG
- 1x USB2.0 Host
- 1x PCIE 2.1/USB3.0 (Multi-PHY)
- 3x SPI
- 2x SDIO 3.0
- 10x UART
- 2x CAN 2.0B
- 5x I2C
- 16x PWM
- 2x SARADC
- 2x MIPI CSI
- 1x MIPI DSI
- 1x 24-bit RGB
- 1x LVDS
- 3x SAI
- 1x SPDIF
- 1x 8-ch PDM
Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and SOM pin-out description file.
OS Support
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Overview
